Subject: Local representatives wanted. Really high wages, no investment is required.

From: "gran gwen" <[email-masked]>
Date: Mon, 10 Sep 2007 12:21:10 +0000

A decade ago, Saraswat's research group was the first to begin developing a new kind of chip architecture: the 3-dimensional integrated circuit (3-D IC). Compared to the 2-D planar chips in computers today, 3-D chips can provide the same processing power with a reduced chip surface area. Also, instead of having long, twisting highways of wires, the stacked chips in 3-D ICs allow for short wires much like elevator shafts, as Professor Chidsey puts it-mitigating the problem of delay in the wires. Moreover, 3-D IC architecture allows the integration of all kinds of chips, since chips that require different technologies or materials can be stacked together.

Hello,
First and foremost, we would kindly like to convey our warmest greetings to you and your relatives and wish you all good condition and happiness and more success in dealing. Our Worldwide Corporation is looking for new employees on various vacancies. We are by now for a long time in the market and now we employ employees to work from home.

Our Company Main center is located in United Kingdom with branches all over the world. Our supreme wish now is to enlarge our business level to more countries, so we are advertising here in hope of cooperating with you all. We highly appreciate honest and creative employers. You do not need to spend any sum of money and we do not ask you to give us with your bank account requisites! We are engaged in completely officially authorized activity and working in our company you can reach career growth at a permanent job.

We are seeking a highly motivated specialist, with skill of working with people. The position is home-based. We offer a part-time position with flexible working hours. And we would be happy to consider a full-time job share candidate.
 
The right person will have good communication and interpersonal skills and some knowledge of advertising. Candidates must be able to remain focused and motivated when working alone.

Thank you and we are looking forward to cooperate in long term basis with you all.
If you are interested in our vacancies, please feel free to contact us for further information.
The preference is given to people with understanding of foreign languages. If you are interested please send next information to: [email-masked]
1) Full name
2) Contact phone numbers
3) Languages
4) Part time job/Full time

We are looking forward to hearing from you soon.

Yours sincerely,
dennis arvandus

In your brain right now, a motor protein called kinesin is shuttling vesicles loaded with neurotransmitters to the synapses in your brain, allowing you to read this. While some researchers are trying to make similar molecular motors scoot around and throw switches on electronic chips, it's hardly certain these motors can ever do better than the electrical contacts that are routinely used today. The future of biological nanotechnology may not be clear, but what is, says Professor
A decade ago, Saraswat's research group was the first to begin developing a new kind of chip architecture: the 3-dimensional integrated circuit (3-D IC). Compared to the 2-D planar chips in computers today, 3-D chips can provide the same processing power with a reduced chip surface area. Also, instead of having long, twisting highways of wires, the stacked chips in 3-D ICs allow for short wires much like elevator shafts, as Professor Chidsey puts it-mitigating the problem of delay in the wires. Moreover, 3-D IC architecture allows the integration of all kinds of chips, since chips that require different technologies or materials can be stacked together.
The main challenge in 3-D IC design is performance-weakening heat dissipation, which is already a problem in 2-D chips, as any Stanford students who have written a term paper with their laptops on their laps know. The multi-layer design of 3-D ICs exacerbates the problem, and Mechanical Engineering Professors Ken Goodson and Tom Kenney have been working on flowing fluid through microchannels incorporated in the chips to conduct the heat away.